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ITPC-B vs. ITPC-B-CP2: what generation 2 changes

A comparison of the original ITPC-B panel PC series and the new CP2 generation: full-bonding displays, Rockchip RK3566/RK3568/RK3588 platforms, dual LAN, and 4G/LTE connectivity.

Panel PCITPC-BCP2ARM

The original ITPC-B panels earned their place in kiosks and operator stations as affordable, fanless Android/Linux terminals. The CP2 generation keeps that positioning and modernizes everything around it. If you standardized on the first generation, here is what actually changes.

The headline upgrades

  • Processor platform — from the aging RK3288 to Rockchip RK3566/RK3568/RK3588: multiple times the compute, modern Android/Linux BSPs, and NPU options for local inference on the top tier.
  • Full-bonding display — the touch glass is laminated directly to the LCD: better contrast, no internal condensation gap, and a stiffer front for public use.
  • Dual Gigabit LAN (configuration-dependent) — separate device and management networks, or wired redundancy.
  • Cellular options — 4G/LTE modules for installations beyond reliable Ethernet.
  • Memory and storage headroom — up to 8GB RAM and 128GB eMMC embedded.

Side by side

AspectITPC-B (gen 1)ITPC-B-CP2 (gen 2)
SoCRockchip RK3288RK3566 / RK3568 / RK3588
Display bondingAir gapFull bonding
LAN1× 100M/1GUp to 2× Gigabit
Cellular4G/LTE option
WirelessWi-FiWi-Fi + Bluetooth embedded
Best forExisting single-app terminalsNew deployments, connected fleets

Sizes run 12.1" to 21.5" across the CP2 range — see the ITPC-B150-CP2, ITPC-B156-CP2, and ITPC-B215-CP2. Mechanical cutouts differ from gen 1 on some sizes, so confirm the cutout before planning drop-in replacements.

Migrating a gen-1 fleet or starting fresh? Send sizes, software, and quantities for a validated proposal.

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